| General information |
| |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon (咨询特价) |
| Model number @ | W(咨询特价) |
| CPU part numbers | - AT80601000918AB is an OEM/tray microprocessor
- BX80601W(咨询特价) is a boxed microprocessor
|
| Frequency @ | (咨询特价) MHz |
| Turbo frequency | (咨询特价) MHz |
| Bus speed @ | 6.4 GT/s QPI (3200 MHz) |
| Clock multiplier @ | 24 |
| Package | (咨询特价)-land Flip-Chip Land Grid Array (FC-LGA8) |
| Socket | Socket 1366 / B / LGA(咨询特价) |
| Size | (咨询特价)" x 1.67" / 4.5cm x 4.25cm |
| Introduction date | Mar 29, (咨询特价) |
| End-of-Life date | Last order date is September 27, (咨询特价) Last shipment date for tray processors is September 5, (咨询特价) |
| Price at introduction | $999 |
| |
| S-spec numbers |
| |
| | ES/QS processors | Production processors | | Part number | Q1DV | Q1HJ | SLBES | | AT80601000918AB | + | + | + |
|
| |
| Architecture / Microarchitecture |
| |
| Microarchitecture | Nehalem |
| Platform | Tylersburg-WS |
| Processor core @ | Nehalem-WS |
| Core steppings @ | C0 (Q1DV) D0 (Q1HJ, SLBES) |
| CPUID | 106A5 (SLBES) |
| Manufacturing process | (咨询特价)5 micron 731 million transistors |
| Die size | 263mm2 |
| Data width | 64 bit |
| The number of cores | 4 |
| The number of threads | 8 |
| Floating Point Unit | Integrated |
| Level 1 cache size @ | 4 x 32 KB 4-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
| Level 2 cache size @ | 4 x 256 KB 8-way set associative caches |
| Level 3 cache size | 8 MB 16-way set associative shared cache |
| Physical memory | 24 GB |
| Multiprocessing | Uniprocessor |
| Features | - MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 @
- EM64T / Extended Memory 64 technology / Intel 64 @
- NX / XD / Execute disable bit @
- HT / Hyper-Threading technology @
- VT-x / Virtualization technology @
- TBT / Turbo Boost technology @
|
| Low power features | - Thread C1/C1E, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology @
|
| |
| Integrated peripherals / components |
| |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 Memory channels: 3 Supported memory: DDR3-800, DDR3-1066, DDR3-(咨询特价) Maximum memory bandwidth (GB/s): 32 ECC supported: Yes |
| Other peripherals | Quick Path Interconnect (1 link) |
| |
| Electrical / Thermal parameters |
| |
| V core @ | 0.8V - 1.375V |
| Minimum/Maximum operating temperature @ | 5°C - 67.9°C |
| Minimum/Maximum power dissipation @ | 12 Watt (TDP in C6 state) / 224.42 Watt |
| Thermal Design Power @ | 130 Watt |
| |